Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD25.09
USD71.09

Pay in 4 interest-free payments of $6.27 Learn more

Field rating
4.5

Verified studio score · Spec revision current

Fit · Size

JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC can replace the screen of

SKU: 18558215177

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 23 - Sep 28

Description

can replace the screen of a variety of models

60 W heating power

camera circuit repairs

Qianli Fire Eye Ultra Thermal imager can quickly diagnose and detect short circuits

XZZ GL-01 360℃ Rotating Circular Glass Clamp and XZZ GL-02 Square High Temperature Resistant Glass Fixture for Mobile Phone Motherboards CPU Chips Soldering Repair

JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC can replace the screen ofJTXTOOLS T4MAX Glue Removal & Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

You may also like

recommand products