YCS 2S Chip Heating Platform for Phone CPU IC Glue Removal Face ID Test Tool Wooden case size: 45*34*56cm

Wooden case size: 45*34*56cm

and 7 interfaces can be used simultaneously

Engraving knife  x3

GX-series: GX200

With additional cleaning sponge

YCS 2S Chip Heating Platform for Phone CPU IC Glue Removal Face ID Test Tool Wooden case size: 45*34*56cmYCS 2S Chip Heating Platform for mobile phone iPhone IC glue removal. MaAnt SL 2 CPU Chip Glue Heating Removal Station for Phone IC Chips Heating Degumming. YCS 2S CPU chip glue heating removal platform for iPhone repair. YCS mobile phone repair tool. Efficient preheating, a versatile soldering platform, and safe, efficient chip debonding. Option: 1. YCS 2S CPU chip glue heating removal platform it's been discontinued. 2. MaAnt SL 2 CPU Chip Glue