SKU: 32829527431
Ships within 48 hours · Estimated delivery Sep 19 - Sep 24
Length adjustment: Fix the grinding moving length by adjusting the stop block
In System Programming (ISP) now possible for MMC and UFS flash memory types
upper and lower sponge cushion protection design
the innovative 3D thermal field mode is more intuitive
which is warm light
HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V Length adjustment: Fix the grindingHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.
US$ 295.00
US$ 23.95
US$ 297.50
US$ 147.50
