LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope screen will not fall off

screen will not fall off even if damaged

Extremely low noise and space saving design

and the temperature can be adjusted from 50 to 130 °C

1)  Use Sony IMX317 Sensor

Gross Weight: 55kg

LUOWEI HS3 Preheating Platform Phone PCB Layering IC Glue Remover Oscilloscope screen will not fall offLuowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc. Features: 1. Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient